Tokyo Seimitsu (Accretech)

Wafer dicing, grinding, and metrology equipment maker.

Ticker: TSE: 7729
Headquarters: Tokyo
Founded: 1949
Market position: major
Value-chain segment: Assembly & Packaging Equipment, Metrology & Inspection

Customers

Sources

https://en.wikipedia.org/wiki/Tokyo_Seimitsu_(Accretech)

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