Haesung DS vs TTM Technologies
Haesung DS's primary segment is Packaging Materials (Leadframes, Bonding Wire); TTM Technologies's is Substrates. TTM Technologies is larger by market cap ($12.0B vs $680M). TTM Technologies reports higher tracked revenue ($2.9B vs $474M).
Shared segment: Materials.
Side-by-side
| Haesung DS | TTM Technologies | |
|---|---|---|
| Market cap | $680M | $12.0B |
| Revenue | $474M (FY2025) | $2.9B (FY2025) |
| Primary segment | Packaging Materials (Leadframes, Bonding Wire) | Substrates |
| Market position | niche | major |
| Country | South Korea | United States |
| Tracked suppliers | 0 | 0 |
| Tracked customers | 7 | 7 |
| Chokepoint / criticality | 50/100 | 68/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-09-16. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Haesung DS and TTM Technologies compare
- Size: TTM Technologies is the larger company by market cap.
- Revenue: TTM Technologies reports higher tracked revenue.
- Supply-chain criticality: TTM Technologies has the higher chokepoint score (68/100 vs 50/100).
- Footprint: Haesung DS (South Korea) vs TTM Technologies (United States).
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Cite as: wafergraph, “Haesung DS vs TTM Technologies”, https://wafergraph.com/compare/haesung_ds-vs-ttm (data as of 2026-09-16).