{"generated":"2026-07-29","method":"Curated by hand from docs/EDGE_RESEARCH_2026-07-26.md, docs/EDGE_RESEARCH_2026-07-29.md, and data/enrichment/edge_citations.json (the automated SEC pipeline). Every quote is copied verbatim from those sources; every pair is verified to exist as a supplier/customer edge in data/companies.json. Excludes citations for pairs not yet in the dataset graph (e.g. new-edge candidates awaiting Jason’s review) and citations without an exact verbatim sentence on record.","citations":[{"supplier":"yageo","customer":"apple","quote":"Yageo Corporation — Guangdong, Jiangsu, Shanghai, Sichuan (China mainland); Riau Islands (Indonesia); Taiwan (Taiwan)","source_url":"https://www.apple.com/supply-chain/pdf/Apple-Supplier-List.pdf","source_title":"Apple Supplier List (FY2023)","filed":"2024-04","added":"2026-07-26"},{"supplier":"jx_advanced_metals","customer":"apple","quote":"JX Nippon Mining & Metals Corporation (Eneos Holding) — Kanagawa, Oita (Japan)","source_url":"https://www.apple.com/supply-chain/pdf/Apple-Supplier-List.pdf","source_title":"Apple Supplier List (FY2023)","filed":"2024-04","added":"2026-07-26"},{"supplier":"silicon_motion","customer":"micron","quote":"Our customers constituting more than 10% of our net revenue were (i) Micron, SK Hynix and AFASTOR in 2023...","source_url":"https://www.sec.gov/Archives/edgar/data/1329394/000119312526197184/d17718d20f.htm","source_title":"Silicon Motion FY2025 20-F","filed":"2026-04-30","added":"2026-07-26"},{"supplier":"silicon_motion","customer":"kioxia","quote":"Our customers constituting more than 10% of our net revenue were (i) Micron, SK Hynix and AFASTOR in 2023...","source_url":"https://www.sec.gov/Archives/edgar/data/1329394/000119312526197184/d17718d20f.htm","source_title":"Silicon Motion FY2025 20-F","filed":"2026-04-30","added":"2026-07-26"},{"supplier":"sitime","customer":"apple","quote":"Sales attributable to Apple, our largest end customer accounted for approximately 17%, 22%, and 21% of our revenue for the years ended December 31, 2025, 2024, and 2023, respectively.","source_url":"https://www.sec.gov/Archives/edgar/data/1451809/000145180926000012/sitm-20251231.htm","source_title":"SiTime FY2025 10-K","filed":"2026-02-11","added":"2026-07-26"},{"supplier":"soitec","customer":"umc","quote":"we purchased a majority of our silicon wafers from Shin-Etsu Handotai... GlobalWafers, Sumco Group... and Soitec.","source_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm","source_title":"UMC FY2025 20-F","filed":"2026-04-30","added":"2026-07-26"},{"supplier":"soitec","customer":"xfab","quote":"X-FAB AND SOITEC TO OFFER SMARTSIC FOR POWER DEVICES MANUFACTURING TO MULTIPLE FABLESS CUSTOMERS INTERNATIONALLY","source_url":"https://www.soitec.com/docs/default-source/financial-reports/2023-2024/soitec-fy24-results.pdf","source_title":"Soitec FY2024 results deck","filed":"2024","added":"2026-07-26"},{"supplier":"dupont","customer":"skywater","quote":"Rohm and Haas EM LLC (a subsidiary of DuPont) (photoresist)","source_url":"https://www.sec.gov/Archives/edgar/data/1819974/000181997426000009/skyt-20251228.htm","source_title":"SkyWater FY2025 10-K","filed":"2026-03-11","added":"2026-07-26"},{"supplier":"merck_kgaa","customer":"skywater","quote":"EMD Performance Materials Corp (Versum) (specialty chemicals and gases)","source_url":"https://www.sec.gov/Archives/edgar/data/1819974/000181997426000009/skyt-20251228.htm","source_title":"SkyWater FY2025 10-K","filed":"2026-03-11","added":"2026-07-26"},{"supplier":"digital_realty","customer":"equinix","quote":"6  Equinix  14  95,641  2.0 %  4.6","source_url":"https://www.sec.gov/Archives/edgar/data/1297996/000110465926015365/dlr-20251231x10k.htm","source_title":"Digital Realty FY2025 10-K","filed":"2026-02-13","added":"2026-07-26"},{"supplier":"jabil","customer":"arista","quote":"Our primary manufacturing partners are Jabil Inc., Sanmina Corporation, Flex Ltd. and Foxconn Hon Hai.","source_url":"https://www.sec.gov/Archives/edgar/data/1596532/000159653225000028/anet-20241231.htm","source_title":"Arista FY2024 10-K","filed":"2025-02-19","added":"2026-07-26"},{"supplier":"foxconn","customer":"arista","quote":"Our primary manufacturing partners are Jabil Inc., Sanmina Corporation, Flex Ltd. and Foxconn Hon Hai.","source_url":"https://www.sec.gov/Archives/edgar/data/1596532/000159653225000028/anet-20241231.htm","source_title":"Arista FY2024 10-K","filed":"2025-02-19","added":"2026-07-26"},{"supplier":"qualcomm","customer":"samsung","quote":"the premium Snapdragon 8 Gen 3 Mobile Platform for Galaxy is powering Samsung Electronics...","source_url":"https://www.qualcomm.com/news/releases/2024/01/qualcomm-and-samsung-bring-the-most-advanced-snapdragon-ever-to-","source_title":"Qualcomm–Samsung Galaxy S24 press release","filed":"2024-01","added":"2026-07-26"},{"supplier":"qualcomm","customer":"dell","quote":"Dell is all-in on this AI PC era... AI PCs which now includes devices powered by Snapdragon X Series. — Sam Burd, Dell","source_url":"https://www.qualcomm.com/news/releases/2024/06/qualcomm-computex-2024-keynote-unveils--the-pc-reborn--with-snap","source_title":"Qualcomm Computex 2024 keynote press release","filed":"2024-06","added":"2026-07-26"},{"supplier":"qualcomm","customer":"lenovo","quote":"...the latest Lenovo ThinkPad T14s Gen 6 and Yoga Slim 7x Copilot+ PCs... — Luca Rossi, Lenovo","source_url":"https://www.qualcomm.com/news/releases/2024/06/qualcomm-computex-2024-keynote-unveils--the-pc-reborn--with-snap","source_title":"Qualcomm Computex 2024 keynote press release","filed":"2024-06","added":"2026-07-26"},{"supplier":"jiangfeng","customer":"tsmc","quote":"江丰电子...产品客户台积电、中芯国际、SK 海力士、联华电子...(customers: TSMC, SMIC, SK Hynix, UMC)","source_url":"https://web.archive.org/web/20260217212831/http://www.kfmic.com/?products_17/","source_title":"Jiangfeng Electronic company site (archived)","filed":"2026-02-17","added":"2026-07-26"},{"supplier":"jiangfeng","customer":"smic","quote":"江丰电子...产品客户台积电、中芯国际、SK 海力士、联华电子...(customers: TSMC, SMIC, SK Hynix, UMC)","source_url":"https://web.archive.org/web/20260217212831/http://www.kfmic.com/?products_17/","source_title":"Jiangfeng Electronic company site (archived)","filed":"2026-02-17","added":"2026-07-26"},{"supplier":"jiangfeng","customer":"sk_hynix","quote":"江丰电子...产品客户台积电、中芯国际、SK 海力士、联华电子...(customers: TSMC, SMIC, SK Hynix, UMC)","source_url":"https://web.archive.org/web/20260217212831/http://www.kfmic.com/?products_17/","source_title":"Jiangfeng Electronic company site (archived)","filed":"2026-02-17","added":"2026-07-26"},{"supplier":"jiangfeng","customer":"umc","quote":"江丰电子...产品客户台积电、中芯国际、SK 海力士、联华电子...(customers: TSMC, SMIC, SK Hynix, UMC)","source_url":"https://web.archive.org/web/20260217212831/http://www.kfmic.com/?products_17/","source_title":"Jiangfeng Electronic company site (archived)","filed":"2026-02-17","added":"2026-07-26"},{"supplier":"fujifilm","customer":"skywater","quote":"FUJIFILM Electronic Materials USA, Inc. (photoresist)","source_url":"https://www.sec.gov/Archives/edgar/data/1819974/000181997426000009/skyt-20251228.htm","source_title":"SkyWater FY2025 10-K","filed":"2026-03-11","added":"2026-07-26"},{"supplier":"ase","customer":"lattice","quote":"All of our assembly and test operations are performed by industry-leading outsourced assembly and test suppliers ('OSATs') with our primary supplier being Advanced Semiconductor Engineering, Inc. ('ASE').","source_url":"https://www.sec.gov/Archives/edgar/data/855658/000143774926004100/lscc20260103_10k.htm","source_title":"Lattice FY2025 10-K","filed":"2026-02-13","added":"2026-07-29"},{"supplier":"dell","customer":"hive_digital","quote":"the Company announced the purchase of 504 Nvidia Blackwell B200 GPUs installed in 63 Dell XE9680L servers with InfiniBand... which were received in March 2026.","source_url":"https://www.sec.gov/Archives/edgar/data/1720424/000106299326002973/form10k.htm","source_title":"Hive Digital 10-K","filed":"2026-06-02","added":"2026-07-29"},{"supplier":"foxconn","customer":"broadcom","quote":"We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.","source_url":"https://www.sec.gov/Archives/edgar/data/1730168/000173016825000121/avgo-20251102.htm","source_title":"Broadcom FY2025 10-K","filed":"2025-12-18","added":"2026-07-29"},{"supplier":"tokyo_electron","customer":"ase","quote":"We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.","source_url":"https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm","source_title":"ASE FY2025 20-F","filed":"2026-04-01","added":"2026-07-29"},{"supplier":"sony","customer":"apple","quote":"Sony Corporation — Aichi, Kumamoto, Miyagi, Nagasaki, Oita, Yamagata — Japan","source_url":"https://www.apple.com/supply-chain/pdf/Apple-Supplier-List.pdf","source_title":"Apple Supplier List (FY2023)","filed":"2024-04","added":"2026-07-29"},{"supplier":"murata","customer":"apple","quote":"Murata Manufacturing Company Limited — Chengdu, Guangdong, Jiangsu","source_url":"https://www.apple.com/supply-chain/pdf/Apple-Supplier-List.pdf","source_title":"Apple Supplier List (FY2023)","filed":"2024-04","added":"2026-07-29"},{"supplier":"shin_etsu","customer":"skywater","quote":"SEH America Inc, subsidiary of Shin-Etsu Handotai, Ltd. (silicon wafers)","source_url":"https://www.sec.gov/Archives/edgar/data/1819974/000181997426000009/skyt-20251228.htm","source_title":"SkyWater FY2025 10-K","filed":"2026-03-11","added":"2026-07-29"},{"supplier":"umc","customer":"ti","quote":"Our primary customers... include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.","source_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm","source_title":"UMC FY2025 20-F","filed":"2026-04-30","added":"2026-07-29"},{"supplier":"umc","customer":"intel","quote":"Our primary customers... include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.","source_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm","source_title":"UMC FY2025 20-F","filed":"2026-04-30","added":"2026-07-29"},{"supplier":"oracle","customer":"meta","quote":"Oracle is raising money in order to build additional capacity to meet the contracted demand from our largest Oracle Cloud Infrastructure customers, including AMD, Meta, NVIDIA, OpenAI, TikTok, xAI and others.","source_url":"https://www.sec.gov/Archives/edgar/data/1341439/000119312526032650/d36096dfwp.htm","source_title":"Oracle FWP (SEC-filed)","filed":"2026-02-01","added":"2026-07-29"},{"supplier":"amd","customer":"openai","quote":"In October 2025, we entered into a product purchase agreement with OpenAI OpCo, LLC, (OpenAI) to deploy 6 gigawatts of AMD GPUs, with the deployment of the first gigawatt... powered by our AMD Instinct MI450 series products.","source_url":"https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm","source_title":"AMD FY2025 10-K","filed":"2026-02-04","added":"2026-07-29"},{"supplier":"innoscience","customer":"nvidia","quote":"successfully entered the high-voltage direct current (800V HVDC) solution supply system of multiple domestic and international leading customers including NVIDIA, becoming a core supplier for AI infrastructure construction","source_url":"https://www.hkexnews.hk/listedco/listconews/sehk/2026/0430/2026043003656.pdf","source_title":"InnoScience 2025 Annual Report (HKEX)","filed":"2026-04-30","added":"2026-07-29"},{"supplier":"arm","customer":"qualcomm","quote":"We can provide no assurances regarding the outcome of either litigation or how the litigation will affect our relationship with or revenue from Qualcomm, which is currently a major customer of ours and accounted for 9% of our total revenue for the fiscal year ended March 31, 2026.","source_url":"https://www.sec.gov/Archives/edgar/data/1973239/000197323926000097/arm-20260331.htm","source_title":"Arm Holdings FY2026 20-F","filed":"2026-05-26","added":"2026-07-25"},{"supplier":"ceva","customer":"unisoc","quote":"Sales to UNISOC (formerly Spreadtrum Communications, Inc.), accounted for 15% and 15% of our total revenues for 2025 and 2024, respectively.","source_url":"https://www.sec.gov/Archives/edgar/data/1173489/000143774926006091/ceva20251231_10k.htm","source_title":"Ceva FY2025 10-K","filed":"2026-02-27","added":"2026-07-25"},{"supplier":"stmicro","customer":"apple","quote":"In 2025 our largest customer, Apple, accounted for 17.7% of our total revenues.","source_url":"https://www.sec.gov/Archives/edgar/data/932787/000093278726000009/stm-20251231.htm","source_title":"STMicroelectronics FY2025 20-F","filed":"2026-02-26","added":"2026-07-25"},{"supplier":"qorvo","customer":"apple","quote":"We provide products to our largest end customer, Apple Inc. (\"Apple\"), through sales to multiple contract manufacturers, which in the aggregate accounted for 50% and 47% of total revenue in fiscal years 2026 and 2025, respectively.","source_url":"https://www.sec.gov/Archives/edgar/data/1604778/000162828026032873/rfmd-20260328.htm","source_title":"Qorvo FY2026 10-K","filed":"2026-05-08","added":"2026-07-25"},{"supplier":"skyworks","customer":"apple","quote":"During fiscal 2025, fiscal 2024, and fiscal 2023, Apple, through sales to multiple distributors, contract manufacturers, and direct sales for multiple applications including smartphones, tablets, desktop, and notebook computers, watches and other devices, in the aggregate accounted for 67 %, 69 %, and 66 % of the Company’s net revenue, respectively.","source_url":"https://www.sec.gov/Archives/edgar/data/4127/000000412725000085/swks-20251003.htm","source_title":"Skyworks FY2025 10-K","filed":"2025-11-07","added":"2026-07-25"},{"supplier":"ase","customer":"qualcomm","quote":"Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.","source_url":"https://www.sec.gov/Archives/edgar/data/804328/000080432825000085/qcom-20250928.htm","source_title":"Qualcomm FY2025 10-K","filed":"2025-11-05","added":"2026-07-29"},{"supplier":"amkor","customer":"qualcomm","quote":"Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.","source_url":"https://www.sec.gov/Archives/edgar/data/804328/000080432825000085/qcom-20250928.htm","source_title":"Qualcomm FY2025 10-K","filed":"2025-11-05","added":"2026-07-29"},{"supplier":"ase","customer":"broadcom","quote":"We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.","source_url":"https://www.sec.gov/Archives/edgar/data/1730168/000173016825000121/avgo-20251102.htm","source_title":"Broadcom FY2025 10-K","filed":"2025-12-18","added":"2026-07-29"},{"supplier":"amkor","customer":"broadcom","quote":"We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.","source_url":"https://www.sec.gov/Archives/edgar/data/1730168/000173016825000121/avgo-20251102.htm","source_title":"Broadcom FY2025 10-K","filed":"2025-12-18","added":"2026-07-29"},{"supplier":"tsmc","customer":"broadcom","quote":"We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.","source_url":"https://www.sec.gov/Archives/edgar/data/1730168/000173016825000121/avgo-20251102.htm","source_title":"Broadcom FY2025 10-K","filed":"2025-12-18","added":"2026-07-29"},{"supplier":"ase","customer":"amd","quote":"The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.","source_url":"https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm","source_title":"AMD FY2025 10-K","filed":"2026-02-04","added":"2026-07-29"},{"supplier":"kulicke_soffa","customer":"huatian","quote":"Tianshui Huatian Technology Co., Ltd 12.0%","source_url":"https://www.sec.gov/Archives/edgar/data/56978/000005697825000081/klic-20251004.htm","source_title":"Kulicke & Soffa FY2025 10-K","filed":"2025-11-20","added":"2026-07-29"},{"supplier":"teradyne","customer":"ase","quote":"We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.","source_url":"https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm","source_title":"ASE FY2025 20-F","filed":"2026-04-01","added":"2026-07-29"},{"supplier":"advantest","customer":"ase","quote":"We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.","source_url":"https://www.sec.gov/Archives/edgar/data/1122411/000119312526135585/d50802d20f.htm","source_title":"ASE FY2025 20-F","filed":"2026-04-01","added":"2026-07-29"},{"supplier":"lam_research","customer":"samsung","quote":"Our most significant customers during the fiscal years ending June 29, 2025, June 30, 2024, and June 25, 2023 included Samsung Electronics Company, Ltd. and Taiwan Semiconductor Manufacturing Company.","source_url":"https://www.sec.gov/Archives/edgar/data/707549/000070754925000075/lrcx-20250629.htm","source_title":"Lam Research FY2025 10-K","filed":"2025-08-11","added":"2026-07-29"},{"supplier":"lam_research","customer":"tsmc","quote":"Our most significant customers during the fiscal years ending June 29, 2025, June 30, 2024, and June 25, 2023 included Samsung Electronics Company, Ltd. and Taiwan Semiconductor Manufacturing Company.","source_url":"https://www.sec.gov/Archives/edgar/data/707549/000070754925000075/lrcx-20250629.htm","source_title":"Lam Research FY2025 10-K","filed":"2025-08-11","added":"2026-07-29"},{"supplier":"entegris","customer":"tsmc","quote":"Percentage of net sales to top customers: Taiwan Semiconductor Manufacturing Company (TSMC) 16% 16% 11%","source_url":"https://www.sec.gov/Archives/edgar/data/1101302/000110130226000012/entg-20251231.htm","source_title":"Entegris FY2025 10-K","filed":"2026-02-11","added":"2026-07-29"},{"supplier":"zeiss_smt","customer":"asml","quote":"The number of lithography systems we are able to produce is limited by the production capacity of one of our key suppliers, Carl Zeiss SMT, our sole supplier of lenses, mirrors, illuminators, collectors and other critical optical components... We have an exclusive arrangement with Carl Zeiss SMT.","source_url":"https://www.sec.gov/Archives/edgar/data/937966/000162828026011378/asml-20251231.htm","source_title":"ASML FY2025 20-F","filed":"2026-02-25","added":"2026-07-29"},{"supplier":"asml","customer":"intel","quote":"ASML Holding N.V. (ASML) is currently the sole supplier of EUV lithography tools that we are deploying in our Intel 4, Intel 3, Intel 18A and planned future leading-edge manufacturing process nodes.","source_url":"https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm","source_title":"Intel FY2025 10-K","filed":"2026-01-23","added":"2026-07-29"},{"supplier":"trumpf","customer":"asml","quote":"We conduct our EUV business almost exclusively in the Netherlands, as this is where our customer ASML has its headquarters.","source_url":"https://www.trumpf.com/filestorage/TRUMPF_Master/Corporate/Annual_report/Current/TRUMPF-Annual-Report-2024-2025.pdf","source_title":"TRUMPF Annual Report 2024/25","filed":"2025-06-30","added":"2026-07-29"},{"supplier":"advantest","customer":"nvidia","quote":"NVIDIA INTERNATIONAL, INC. 228,273 = 20.2%","source_url":"https://www.advantest.com/document/en/investors/ir-library/report/IR_SecuritiesandBusinessReport_84th_en.pdf","source_title":"Advantest FY2026 Securities and Business Report (84th period)","filed":"2026-06","added":"2026-07-29"},{"supplier":"lasertec","customer":"intel","quote":"IntelCorporation 売上高: 83,718百万円","source_url":"https://www.lasertec.co.jp/en/ir/data/securities.html","source_title":"Lasertec Securities Report (63rd period)","filed":"2025-09-25","added":"2026-07-29"},{"supplier":"lasertec","customer":"tsmc","quote":"TSMC ¥66,050M = 26.3%","source_url":"https://www.lasertec.co.jp/en/ir/data/securities.html","source_title":"Lasertec Securities Report (63rd period)","filed":"2025-09-25","added":"2026-07-29"},{"supplier":"lasertec","customer":"samsung","quote":"Samsung ¥49,982M = 19.9%","source_url":"https://www.lasertec.co.jp/en/ir/data/securities.html","source_title":"Lasertec Securities Report (63rd period)","filed":"2025-09-25","added":"2026-07-29"},{"supplier":"shin_etsu","customer":"umc","quote":"we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group... and Soitec.","source_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm","source_title":"UMC FY2025 20-F","filed":"2026-04-30","added":"2026-07-29"},{"supplier":"globalwafers","customer":"umc","quote":"we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group... and Soitec.","source_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm","source_title":"UMC FY2025 20-F","filed":"2026-04-30","added":"2026-07-29"},{"supplier":"sumco","customer":"umc","quote":"we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group... and Soitec.","source_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm","source_title":"UMC FY2025 20-F","filed":"2026-04-30","added":"2026-07-29"},{"supplier":"umc","customer":"mediatek","quote":"Our primary customers... include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.","source_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm","source_title":"UMC FY2025 20-F","filed":"2026-04-30","added":"2026-07-29"},{"supplier":"umc","customer":"realtek","quote":"Our primary customers... include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.","source_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm","source_title":"UMC FY2025 20-F","filed":"2026-04-30","added":"2026-07-29"},{"supplier":"umc","customer":"novatek","quote":"Our primary customers... include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.","source_url":"https://www.sec.gov/Archives/edgar/data/1033767/000119312526193757/d91630d20f.htm","source_title":"UMC FY2025 20-F","filed":"2026-04-30","added":"2026-07-29"},{"supplier":"microsoft","customer":"openai","quote":"The OpenAI API is exclusive to Azure, runs on Azure, and is available through the Azure OpenAI Service.","source_url":"https://www.sec.gov/Archives/edgar/data/789019/000095017025100235/msft-20250630.htm","source_title":"Microsoft FY2025 10-K","filed":"2025-07-30","added":"2026-07-29"},{"supplier":"oracle","customer":"openai","quote":"Oracle is raising money in order to build additional capacity to meet the contracted demand from our largest Oracle Cloud Infrastructure customers, including AMD, Meta, NVIDIA, OpenAI, TikTok, xAI and others.","source_url":"https://www.sec.gov/Archives/edgar/data/1341439/000119312526032650/d36096dfwp.htm","source_title":"Oracle FWP (SEC-filed)","filed":"2026-02-01","added":"2026-07-29"},{"supplier":"broadcom","customer":"openai","quote":"OpenAI and Broadcom... announced a collaboration for 10 gigawatts of custom AI accelerators... long-standing agreements on the co-development and supply of the AI accelerators.","source_url":"https://investors.broadcom.com/news-releases/news-release-details/openai-and-broadcom-announce-strategic-collaboration-deploy-10","source_title":"Broadcom–OpenAI collaboration press release","filed":"2025-10-13","added":"2026-07-29"},{"supplier":"nvidia","customer":"openai","quote":"Announced a strategic partnership with OpenAI to deploy at least 10 gigawatts of NVIDIA systems for OpenAI's next-generation AI infrastructure.","source_url":"https://www.sec.gov/Archives/edgar/data/1045810/000104581025000228/q3fy26pr.htm","source_title":"NVIDIA Q3 FY2026 earnings 8-K","filed":"2025-11-19","added":"2026-07-29"},{"supplier":"coreweave","customer":"openai","quote":"OpenAI has committed to pay us up to approximately $6.5 billion through May 31, 2031... we expect OpenAI to be a significant customer","source_url":"https://www.sec.gov/Archives/edgar/data/1769628/000176962826000104/crwv-20251231.htm","source_title":"CoreWeave FY2025 10-K","filed":"2026-03-02","added":"2026-07-29"},{"supplier":"fujimi","customer":"tsmc","quote":"TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 10,007 16.0 12,053 17.4","source_url":"https://disclosure2dl.edinet-fsa.go.jp/searchdocument/pdf/S100YE62.pdf","source_title":"Fujimi annual securities report, 74th period (EDINET S100YE62), major-customer sales table p.22","filed":"2026-06-19","added":"2026-07-29"},{"supplier":"daifuku","customer":"tsmc","quote":"Taiwan Semiconductor Manufacturing Company, Limited. － － 91,474 13.8","source_url":"https://disclosure2dl.edinet-fsa.go.jp/searchdocument/pdf/S100XT4W.pdf","source_title":"Daifuku annual securities report (EDINET S100XT4W), major-counterparty sales table p.55","filed":"2026-03-24","added":"2026-07-29"},{"supplier":"hanmi_semiconductor","customer":"sk_hynix","quote":"한미반도체는 SK하이닉스와 442억원 규모의 'TC 본더 4.5 그리핀' 장비 공급 계약을 체결했다고 공시했다","source_url":"https://www.thelec.kr/news/articleView.html?idxno=57772","source_title":"THE ELEC, reporting Hanmi Semiconductor's mandatory KRX single-sales-contract disclosure (₩44.2B TC bonders, HBM4, 7.66% of FY2025 revenue)","filed":"2026-06-08","added":"2026-07-29"},{"supplier":"sk_specialty","customer":"sk_hynix","quote":"SK Specialty Co., Ltd. 1,017 [Sales and others] 26,810 [Purchase and others]","source_url":"https://www.sec.gov/Archives/edgar/data/2120882/000119312526289345/d32785df1a.htm","source_title":"SK hynix F-1/A, Note 31 Related Parties (SK hynix purchases from SK Specialty)","filed":"2026-07-06","added":"2026-07-29"}]}