Chipbond Technology
Chipbond Technology is a major in the OSAT segment of the semiconductor & AI supply chain, headquartered in Taiwan. Its key customers include Novatek Microelectronics, Himax Technologies, Fitipower.
Display-driver IC bumping, COG, and gold-bump packaging and test leader.
- Ticker
- TPEx: 6147
- Headquarters
- Taiwan
- Revenue
- $666M (FY2025) · +5.5% YoY
- Net income
- $86M
- Operating margin
- 19.3%
- Market position
- major
- Value-chain segment
- Outsourced Assembly & Test
- Key products
- Gold-bump wafer bumping for display driver ICs, Chip-on-Glass (COG) bonding, Flip-chip bumping and assembly, Tape Carrier Package (TCP) services, Known-good-die (KGD) test and sort
About Chipbond Technology
Chipbond Technology, headquartered in Taiwan, operates in the Outsourced Assembly & Test segment of the semiconductor & AI supply chain and is positioned as a market major there. Its key products include Gold-bump wafer bumping for display driver ICs, Chip-on-Glass (COG) bonding, Flip-chip bumping and assembly, Tape Carrier Package (TCP) services, Known-good-die (KGD) test and sort. wafergraph maps 9 tracked customers for Chipbond Technology across the value chain. It has a supply-chain criticality score of 68/100, with 236 companies downstream of it.
Key products
- Gold-bump wafer bumping for display driver ICs
- Chip-on-Glass (COG) bonding
- Flip-chip bumping and assembly
- Tape Carrier Package (TCP) services
- Known-good-die (KGD) test and sort
Customers
More OSAT companies
Compare with
ASE Technology · JCET Group · Tongfu Microelectronics · Amkor Technology · King Yuan Electronics (KYEC) · Huatian Technology
Sources
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