Chipbond Technology vs Huatian Technology
Huatian Technology is larger by market cap ($9.0B vs $3.6B). Huatian Technology reports higher tracked revenue ($2.6B vs $666M). Both are primarily Outsourced Assembly & Test companies.
Shared segment: OSAT.
Side-by-side
| Chipbond Technology | Huatian Technology | |
|---|---|---|
| Market cap | $3.6B | $9.0B |
| Revenue | $666M (FY2025) | $2.6B (FY2025) |
| Primary segment | Outsourced Assembly & Test | Outsourced Assembly & Test |
| Market position | major | major |
| Country | Taiwan | China |
| Tracked suppliers | 0 | 8 |
| Tracked customers | 9 | 6 |
| Chokepoint / criticality | 68/100 | 68/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-08-12. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chipbond Technology and Huatian Technology compare
- Size: Huatian Technology is the larger company by market cap.
- Revenue: Huatian Technology reports higher tracked revenue.
- Supply-chain criticality: Chipbond Technology has the higher chokepoint score (68/100 vs 68/100).
- Footprint: Chipbond Technology (Taiwan) vs Huatian Technology (China).