Nepes

As of 2026-10-09, Nepes has 1 tracked supplier and 6 tracked customers in this dataset; its largest supplier by market cap is Deca Technologies. The customer list here follows a shared pattern for this segment rather than being individually confirmed for Nepes — see /methodology.

Sourced from 2 references — primary source, Wikipedia — last verified .

Korean OSAT specializing in fan-out advanced packaging.

Ticker
KOSDAQ: 033640
Headquarters
South Korea
Market position
niche
Value-chain segment
Outsourced Assembly & Test, Advanced Packaging Services
Key products
flip-chip bumping and test, fan-out panel-level packaging (FOPLP)

About Nepes

Nepes, headquartered in South Korea, operates in the Outsourced Assembly & Test and Advanced Packaging Services segments of the semiconductor & AI supply chain and is positioned as a market niche there. Its key products include flip-chip bumping and test, fan-out panel-level packaging (FOPLP). wafergraph maps 1 tracked supplier and 6 tracked customers for Nepes across the value chain. It has a supply-chain criticality score of 50/100, with 236 companies downstream of it.

Role in the chain

Nepes is a market niche in OSAT (Outsourced Assembly & Test), headquartered in South Korea. Korean OSAT specializing in fan-out advanced packaging.

Diligence questions

  1. The dataset records 1 tracked supplier for Nepes. Which of those edges are researched (named in a filing or primary source) versus segment-inferred, and what happens if one of them stops shipping?
  2. The dataset names 6 tracked customers for Nepes. How concentrated is demand among those names, and which of them have a documented second source in this graph?
  3. Nepes is headquartered in South Korea. What jurisdiction, export-control or logistics risk sits at that HQ, versus at the fabs or plants the filings actually name?
  4. Nepes trades as KOSDAQ:033640. What does the latest reported period say about capacity and backlog versus the graph position above?
  5. Before treating any edge as a verified relationship, check the provenance labels on the company page and the method note at /methodology.

Full diligence pack for Nepes

Key products

  • flip-chip bumping and test
  • fan-out panel-level packaging (FOPLP)

Suppliers

Customers

More OSAT companies

Compare with

JCET Group · Tongfu Microelectronics · Amkor Technology · King Yuan Electronics (KYEC) · Huatian Technology · Powertech Technology (PTI)

Sources

Open the interactive supply-chain view →

Cite as: wafergraph, “Nepes — supply chain, financials & market position”, https://wafergraph.com/company/nepes (data as of 2026-10-09).

Track the chain

What moved in the semiconductor supply chain — This Week in the Chain, the free weekly wafergraph briefing.

Subscribe to the free weekly briefing →

Free · no login · 615 companies, updated weekly