Packaging Materials (Leadframes, Bonding Wire) companies

Companies

• Mitsui High-tec — Leading leadframe maker and precision stamping specialist. leader · TSE:6966 · $1.4B rev · Japan
• Kyocera — Ceramic packages, substrates, and electronic components. major · TSE:6971 · $13.0B rev · Japan
• Sumitomo Metal Mining — Materials maker supplying bonding wire, plating, and target metals. major · TSE:5713 · $11.0B rev · Japan
• Nitto Denko Corporation — Japanese materials group; supplies semiconductor wafer dicing tape and back-grinding tape. major · TSE:6988 · $6.5B rev · Japan
• Toray Industries — Japanese materials group; supplies PHOTONEECE photosensitive polyimide used for passivation and dielectric layers in semiconductor packaging. major · TSE:3402 · $16.3B rev · Japan
• Element Solutions — Specialty chemicals for electronics assembly and advanced packaging. major · NYSE:ESI · $2.6B rev · United States
• Chang Wah Technology — Leadframe and semiconductor packaging materials maker. major · TWSE:6548 · Taiwan
• Tanaka Precious Metals — Precious-metals group supplying bonding wire, plating, and targets. major · Japan
• Sumitomo Bakelite — Semiconductor encapsulation resins and packaging materials. niche · TSE:4203 · $2.0B rev · Japan
• Haesung DS — Korean leadframe and package-substrate maker. niche · KRX:195870 · $461M rev · South Korea
• MK Electron — Korean bonding-wire and solder-materials maker. niche · KOSDAQ:033160 · $990M rev · South Korea