Chipbond Technology vs Nepes
Both are primarily Outsourced Assembly & Test companies. Chipbond Technology is larger by market cap ($5.1B vs $430M).
Shared segment: OSAT.
Side-by-side
| Chipbond Technology | Nepes | |
|---|---|---|
| Market cap | $5.1B | $430M |
| Revenue | $673M (FY2025) | — |
| Primary segment | Outsourced Assembly & Test | Outsourced Assembly & Test |
| Market position | major | niche |
| Country | Taiwan | South Korea |
| Tracked suppliers | 0 | 1 |
| Tracked customers | 9 | 6 |
| Chokepoint / criticality | 68/100 | 50/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-09-16. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chipbond Technology and Nepes compare
- Size: Chipbond Technology is the larger company by market cap.
- Supply-chain criticality: Chipbond Technology has the higher chokepoint score (68/100 vs 50/100).
- Footprint: Chipbond Technology (Taiwan) vs Nepes (South Korea).
Company hubs
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Cite as: wafergraph, “Chipbond Technology vs Nepes”, https://wafergraph.com/compare/chipbond-vs-nepes (data as of 2026-09-16).